Royce Bond Testers

Royce Instrument’s lineup of dedicated bond testing equipment.

Royce 610 Wire Pull Bond Tester

The controls of the 610 are simple and ergonomic. Using the extremely flexible Olympus SZ61 microscope, the 610 easily adjusts to accommodate a broad spectrum of users. The familiar controls make training quick and easy, minimizing downtime. The standard computer mouse controls the hook height and rotation, along with triggering the test. A numeric keypad allows the operator to enter failure codes, and the test results are visible on the LCD panel built into the mainframe.

Able to perform both destructive and non-destructive tests, the 610 collects force data against the wire every 10 microseconds. When performing destructive bond testing the maximum load is monitored and the test stops automatically when the load force falls from its maximum. Non-destructive testing is controlled so that the rate of load application exactly meets the user's programmed limit. Load variance also is programmable by the user prior to testing to provide stricter controls.

  • Dimensions: Height 460 mm (18 in) Width 320 mm (12.5 in) Depth 560 mm (22 in) Weight 27 kg (59.5 lbs)

    Power required: 90 – 264 VAC, 47 – 63 Hz

  • Ergonomic design to support operator comfort over long shifts.

    Simple calibration interface to allow user to quickly and easily check and recalibrate the instrument with on-screen instructions (NIST traceable calibration weights available)

  • Optional strip printer

    Optional keypad for enhanced failure code input

    Optional external Royce PC with Bond Test Manager software for data storage and networking

Royce 620 Multitest Bond Tester

The Royce 620 Multitest Bond Tester offers an attractive bond test solution that is midway between the Royce 650 and the Royce 610. It performs all of the most frequently used applications, and it employs manual sample positioning, which in some applications allows for higher productivity over a motorized XY stage.

  • Dimensions: Height 560 mm (22 in) Width 432 mm (17 in) Depth 585 mm (23 in) Weight 50 kg (110.5 lbs)

    Power supply: 90 – 264VAC, 47 – 63 Hz

    Pneumatic supply: 420 – 550 kPa, (60 – 80 psi)

    Vacuum supply: 500 mm Hg, 67.7 kPa, (20 in Hg)

  • Responsive joystick and manipulator: The operator controls the Royce 620 using a joystick and manipulator.

    The joystick allows the operator to control the Z height positioning of the module (and tool rotation for wire pull testing), while the manual manipulator allows the operator to control the XY and theta movements of the part.

    Compatibility with legacy systems: The Royce 620 is fully compatible with the Royce 550 and Royce 552 manipulators, test piece holders, and tools.

Royce 650 Universal Bond Tester

Based on field-proven technology, the Royce 650 Universal Bond Tester offers the most robust selection of capabilities in the Royce bond tester family, from the full range of standard test applications through custom testing. This high-end instrument is versatile and powerful enough to meet your complete bond testing needs.

Applications performed by the Royce 650 include: wire pull, ball bond shear, die shear, solder ball (bump) shear, zone shear, tweezer pull, stud pull, die strength 3- point bend (push) test, heated testing, and custom testing to user specifications.

  • Dimensions: Height 635 mm (25 in) Width 432 mm (17 in) Depth 585 mm (23 in) Weight 55 kg (120 lbs)

    Power supply: 90 – 264 VAC, 47 – 63 Hz

    Pneumatic supply: 420 – 550 kPa, (60 – 80 psi)

    Vacuum supply: 500 mm Hg, 67.7 kPa, (20 in Hg)

  • Motorized height controlled microscope that stays in focus as it moves

    305mm x 155mm stage for 300mm wafers, leadframes or substrates

    Ultra Fine Pitch (UFP) capable

    Image Capture Option, Field Upgradable

    World Language support

    Ribbon Bond testing for standard to high-power devices

    Die shear up to 200 kgf

    Robust test modules with range switching, on board calibration memory, and tool protection